| Type |
CPU / Microprocessor |
| Market segment |
Embedded |
| Family |
Intel Core i* Mobile |
| Model number |
i*-*10E |
| CPU part numbers |
- CN80*1*005*45AB is an OEM/tray microprocessor
- CN80*1*005*45AC is an OEM/tray microprocessor
|
| Frequency |
2533 MHz |
| Turbo frequency |
3200 MHz |
| Bus speed |
2.5 GT/s DMI |
| Clock multiplier |
1* |
| Package |
1288-ball micro-FCBGA10 |
| Socket |
BGA1288 |
| Size |
1.34" x 1.1" / 3.4cm x 2.8cm |
| Introduction date |
January *, 2010 |
| Price at introduction |
$332 |
| S-spec numbers |
| |
ES/QS processors |
Production processors |
| Part number |
Q4NG |
SLBRZ |
SLBXX |
| CN80*1*005*45AB |
|
+ |
|
| CN80*1*005*45AC |
+ |
|
+ | |
| Architecture / Microarchitecture |
| Microarchitecture |
Westmere |
| Platform |
Calpella |
| Processor core |
Arrandale |
| Core steppings |
C2 (SLBRZ)
K0 (Q4NG, SLBXX) |
| CPUIDs |
20*52 (SLBRZ)
20*55 (Q4NG, SLBXX) |
| Manufacturing process |
0.032 micron
382 million transistors (CPU die)
1** million transistors (IMC / graphics die) |
| Die size |
81mm2 (CPU die)
114mm2 (IMC / graphics die) |
| Data width |
*4 bit |
| The number of cores |
2 |
| The number of threads |
4 |
| Floating Point Unit |
Integrated |
| Level 1 cache size |
2 x 32 KB instruction caches
2 x 32 KB data caches |
| Level 2 cache size |
2 x 25* KB |
| Level 3 cache size |
4 MB |
| Physical memory |
8 GB |
| Multiprocessing |
Not supported |
| Features |
- MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4
- AES / Advanced Encryption Standard instructions
- EM*4T / Extended Memory *4 technology / Intel *4
- NX / XD / Execute disable bit
- HT / Hyper-Threading technology
- TBT / Turbo Boost technology
- VT-x / Virtualization technology
- VT-d / Virtualization for directed I/O
- TXT / Trusted Execution technology
|
| Low power features |
- Thread C1, C3 and C* states
- Core C1/C1E, C3 and C* states
- Package C1/C1E, C3 and C* states
- Enhanced SpeedStep technology
|
| Integrated peripherals / components |
| Integrated graphics |
GPU Type: HD (Westmere)
Base frequency (MHz): 500
Maximum frequency (MHz): ***
The number of supported displays: 2 |
| Memory controller |
The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3-10**
Maximum memory bandwidth (GB/s): 1*.1
ECC supported: Yes |
| Other peripherals |
- Direct Media Interface
- PCI Express 2.0 interface
|
| Electrical / Thermal parameters |
| V core |
0.8V - 1.4V (High Frequency mode)
0.**5V - 1V (Low Frequency mode) |
| Minimum/Maximum operating temperature |
0°C - 105°C |
| Maximum power dissipation |
3.8 Watt (TDP in C* state) / **.2 Watt (peak, CPU core only)
44.8 Watt (sustained, CPU core only) |
| Thermal Design Power |
35 Watt (Package)
25 Watt (CPU core)
12.5 Watt (Graphics core) |
| Notes on Intel Core i*-*10E |
- Graphics and memory controllers are located on a separate die, which is manufactured on 0.045 micron technology
- Embedded microprocessor
- The CPU is compatible with Shader Model 4, along with DirectX 10.1 and OpenGL 2.1 APIs. OpenCL API is not supported.
- The graphics unit has the following software features enabled: Intel Clear Video HD technology.
|
